A low cost constant heat bonder with great ergonomics, expandability, and quality.

• Constant heat unit with controller.
• Precision air cylinder with digital pressure regulator for fine pressure control.
• Y-Axis sliding stage keeps hands away from heat and pressure.
• Bonding head size: MAX 100x8mm
• Designed for rapid tooling changeover.
• Field-upgradable to either a 2 or 4-camera TTAB-1008C system for complete FOF, FOB, and FOG alignment capabilities.
• Comprehensive native English manual covering set-up, process development, maintenance, and operation.

Full specifications are available for download through the link below.

A compact, reliable, and flexible system designed for repairing or assembling COG interconnections on flat panel displays. Add the FOG toolkit to allow FOG assembly and repair as well.

• Constant heat system.
• Semi-automatic and Manual Operation settings.
• Password protection for Operation and Engineering menu levels.
• Graph of measured output temperature during operation to provide visual feedback to the operator on equipment functioning.
• Detailed alarm interlocks and error state messages.
• Dual button start switches for operator safety.
• Works for both COG and FOG assemblies.

The CRS-40C handles a larger size of display than most COG machines. Ito Group designed it this way to allow smaller LCD repair houses to purchase one system, add the FOG toolkit, and use the system to handle both COG and FOG repair work.

The CRS-40C is a semi-automatic system that features programmable recipes, a dual heating function allowing both ACF lamination and bonding, and a flexible design that allows many different types of panels to be loaded and used without custom fixtures. The system may also be used for prototyping work or other situations requiring flexibility but not requiring high volume throughput.

Full specifications are available through the link below.

Full Auto ACF Lamination, Auto Alignment Pre Bonding, Main Bonding

The FAS-7100 is a full-auto ACF bonder for devices such as mobile phones. Devices are bonded onto FPCs or PCBs using ACF. This integrated line consists of an ACF Laminator, two Feeders, a Mounter, and a Bonder. The system utilizes carriers similar to SMT pallets; which the substrates are held in during and after the process. Also a carrier recirculation option is available if desired. Each unit of the FAS-7100 uses proven mechanical designs in order to provide the highest level of stability & bond quality. Line units can be configured in any order or sequence required to match the assmbly requirements.

High-precision FPC Mounter/Bonder with Auto-Alignment

The ME-01 is a semi-automatic FPC mounter/bonder designed for applications requiring high precision and reliability, such as medical devices. The operator loads a substrate, after which the operation occurs in a semi-automatic mode. The ME-01 allows for two types of FPCs to be bonded along 4 sides of a substrate, but the operator must manually rotate the panel after each side. The use of automatic alignment and mounting assures that high quality is attained and maintained in production. Also, the software on the ME-01 has been designed to allow the system to be used for repair operations as well, improving utilization.