ACF Flip Chip Mounter with Automatic Alignment System.

The MS-02 is a semi-automatic Flip Chip Mounter with automatic alignment. The substrate is loaded in the unit and multiple chips can be mounted in an array, either on the same or across multiple substrates. A large bonding stage allows this unit to support COG applications with up to 12 inch panels. The MS-02 supports both COG (Chip-on-Glass) and COF (Chip-on-Flex) applications with minimal changeover. Also, units in this line, inlcuding the MS-02, use a common carrier to improve throughput and reduce cost.