Manual Aligner-Bonder for Constant Heat FPC Bonding The BD-03 is a semi-automatic FOG/FOB aligner-bonder. The substrate and FPC are placed on stages and manually aligned with micrometers before being bonded…

Ohashi LD-02 ACF Laminator The Ohashi LD-02 is a compact tabletop single-site ACF laminator. Substrates are set by hand on the stage. The unit then laminates the programmed amount of…

BD-01 Constant Heat Bonder The BD-01 is a semi-automatic tabletop bonder featuring constant heat and a Y-axis sliding stage. It provides highly accurate and economical bonding in a compact form…

BD-02 Pulsed Heat Ceramic Head Bonder The BD-02 is a semi-automatic pulsed heat bonder. The ceramic pulse heating method allows for improved equipment durability, stability, and flexibility, greatly increasing production…