A low cost constant heat ACF bonder for medium and high volume applications

• Constant heat unit with PID thermal controller.
• Precision air cylinder with digital pressure regulator for fine pressure control.
• Rotary stage for high throughput and efficiency (TYP 275UPH)
• Bonding head size: MAX 100x8mm
• Designed for rapid tooling changeover.
• Features unique stage support mechanism, allowing complex 3D devices such as camera modules to be reliably assembled using ACF technology.
• Floating Carrier^TM capable.
• Comprehensive native English manual covering set-up, process development, maintenance, and operation.

Full specifications are available for download through the link below.