Tooling for ACF Bonding of Camera Modules or Other Complex 3D Devices

• Compensates for lack of coplanarity between the top and bottom surfaces of the substrate.
• Successful production history at values of up to 200µm of noncoplanarity.
• Improved cooling function.
• Improved load and unload times
• Antistatic and ESD safe materials.
• Designed for rapid tooling changeover.
• Experience with single cavity through 45-cavity designs.
• Works with Ohashi Engineering or Ito Brand ACF bonding equipment.
• In-house design team with rapid response and prototyping capability

Each camera module is different, and some may benefit more from a Floating Carrier^TM design than others. Typically, if a camera module or other device has noncoplanarity of >30µm between the top and bottom sides, a Floating Carrier^TM design can greatly improve yield, overall reliability, and electrical performance of the bond.

Contact your local sales team for more information and a free evaluation of your camera module using our Pressure Scanning^TM service.